Features of TSE3281:

Excellent thermal conductivity properties

Fast thermal cure times

Excellent adhesion to many substrates without the use of a primer

Outstanding operating temperature performance (-55°C to 200°C)

One component solventless formulation for ease of handling

No cure by- products/ low shrinkage/non- exothermic allows for deep section

Application and use in enclosed assemblies.

Reversion resistance and hydrolytically stable

Outstanding dielectric properties.