SE3281有机硅粘合剂是一种单组分，中等粘度的导热材料，在室温下保持未固化状态，并在加热时固化成弹性体。

关键性能属性

出色的导热性能

快速热固化时间

不使用底漆，对许多基材具有优异的附着力

出色的工作温度性能（-55°C至200°C）

单组分无溶剂配方，易于处理

没有固化副产物/低收缩/非放热允许深度分离

在封闭组件中的应用和使用。

回复抗性和水解稳定性

出色的介电性能。

TSE3281 silicone adhesive is a one component, medium viscosity, thermally conductive material, which remains in an uncured state at room temperature and cure to an elastomer when heat is applied.

Key Performance Properties

Excellent thermal conductivity properties

Fast thermal cure times

Excellent adhesion to many substrates without the use of a primer

Outstanding operating temperature performance (-55°C to 200°C)

One component solventless formulation for ease of handling

No cure by- products/ low shrinkage/non- exothermic allows for deep sectiion

Application and use in enclosed assemblies.

Reversion resistance and hydrolytically stable

Outstanding dielectric properties.