M-Bond 610 Adhesive System Complete Kit套装
This high-performance two component epoxy-phenolic resin was formulated specifically for bonding strain gages and temperature sensors. When properly cured, this two part adhesive is useful for temperatures ranging from deep cryogenic, -269° C (-452° F) (4° K) to 370° C (700° F) for short periods, and -269° C (-452° F) (4° K) to 260° C (500 °F) for long periods. Note that for transducer applications, the recommended temperature upper limit is 230° C (450° F). Like other organic materials, the higher temperature lifetime is limited by oxidation and sublimation effects.这种高性能的两组分环氧酚醛树脂是专门为粘接应变计和温度传感器而配制的。如果正确固化，此两部分粘合剂可用于深低温，短期内-269°C（-452°F）（4°K）到370°C（700°F）以及-269°C的温度范围。 （-452°F）（4°K）到260°C（500°F）长时间。请注意，对于传感器应用，建议的温度上限为230°C（450°F）。像其他有机材料一样，高温寿命受到氧化和升华作用的限制。
The M-bond 610 product is prepared by mixing together the two different components, a "curing agent" and the other, the adhesive. Each kit contains four bottles of each of the two components, the "curing agent" coming in 11 gram bottles and the "adhesive" coming in 14 gram bottles. When used, one bottle of each component is required to make up a total of 25 grams of working adhesive. A total of 100 grams is present in each kit. In addition, each kit contains 4 brush caps for dispensing mixed adhesives and 4 disposable mixing funnels. Each kit comes with mixing instructions, surface preparation instructions, and shelf and pot life information. One should pay particularly close attention to the elongation capabilities and handling precautions.
